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IsoPort™
Asyst's IsoPort, the next generation 300mmm I/O port, breaks new ground
in automated 300mm wafer handling with its industry leading interoperability
and low cost of ownership. It leverages Asyst's proven pioneering
leadership in automation technology to deliver a reliable, economic,
Front-Opening-Unified-Pod (FOUP) interface that is the industry's
most advanced to date.
The IsoPort gives semiconductor tool equipment manufacturers a
highly configurable, automated wafer-handling solution that easily
integrates with any tool. In short, IsoPort offers many advanced
benefits for both equipment makers and chipmakers transitioning
to 300mm wafers.
Maximum Productivity & Profitability
- Provides best-in-class interoperability performance
through precise servo-controlled motion, smart latchkey design,
and optimized carrier sensing.
- Exceeds both the ergonomic and economic necessities
of automation-the results of larger, heavier wafer carriers and
significantly increased yield risks.
- Optimized tool throughput reduces time from
FOUP arrival to first-wafer access to just 8 seconds.
- Best-in-class cleanliness with contamination
conformance to ISO Class 1 particle level.
- Provides low cost of ownership with zero maintenance
design, simple tool integration, and global support.
- Optional gas purge ports provide an inert ambient environment
for wafers in the carrier on the load port
- Configurable design easily integrates all types of automated
carrier identification solutions (RF, infrared, or barcode).
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