Connectivity Seminar, SECS to 300mm

This newly revised, intensive 2-day seminar addresses the practical implementation of SEMI 300mm software automation protocols in semiconductor manufacturing equipment. The seminar describes details of SEMI Standards: SECS-II, GEM, and Global Joint Guideline (GJG). GJG includes a 300mm standards suite for Carrier Management, Substrate Tracking, Control Job, Process Job, and Object Services.

The semiconductor industry has changed dramatically with the transition from 200 to 300mm wafer fabrication. 300mm fabs require Automated Material Handling Systems (AMHS) for FOUP transportation to and from process equipment. In addition, semiconductor manufacturers require an expanded scope of connectivity standards, including single wafer process control and queuing work ahead of process equipment. Simultaneously, more standards are evolving to allow enhanced data collection from equipment. All of the current and near term connectivity standards are covered in this seminar.

Jerry Secrest is the principal consultant of Secrest Research. With over 30 years experience designing semiconductor processes and devices, and managing semiconductor manufacturing lines, he has designed several SECS interfaces, and is presently active in revisions and additions to SEMI automation standards.

Ali Abushanab is a senior integration software engineer in Asyst's Connectivity Solutions Group. He has more than 15 years experience in CIM systems engineering and has designed both 200mm and 300mm connectivity solutions for more than 8 years.

Mark Pendleton is the principal software architect for Asyst’s Connectivity Solutions Group. Focused on technical marketing, Mark is Asyst’s lead for SEMI information and control standards. Mark has over 20 years experience in semiconductor automation integration solutions, and is co-chair of the IEE and OBEM task forces.