“The need for a next generation of equipment connectivity solutions is clear,” said Paula
LuPriore, vice president/general manager, Connectivity Solutions at Asyst. “Existing standards
such as SECS/GEM, while still required, need to be coupled with new technologies and solutions
that meet the challenges of increasing wafer size and decreasing geometries. Manufacturing
rules have changed with 300mm wafer fabrication as isolation technology and automation are no
longer optional. More complex automation systems require more advanced software solutions to
maximize fab productivity and optimize tool utilization. Asyst is first to offer the required
software solutions that feature secure, one-to-many, efficient tool-level communications.”

Addressing these requirements, GWEIB™ and GWconX300+™ are the first in a family of new Asyst software products that have been built upon the emerging SEMI standards coming from the SEMI Diagnostic Data Acquisition (DDA), Object Based Equipment Model (OBEM), Equipment Performance Tracking (EPT) and XML Task Forces, to name a few. Using the recently approved SEMI PR8 Equipment Data Acquisition Solution as the architectural framework, these new products provide a comprehensive answer to the needs of the semiconductor industry that are being driven by new standards such as SEMI E120 Common Equipment Model (CEM), SEMI E116 Equipment Performance Tracking (EPT) and SEMI E125 Equipment Self Description.

GWEIB is flexible and adapts to existing automation solutions in wafer fabrication as well as assembly and test. As part of this flexibility it can be easily integrated with traditional station controllers and non-SECS equipment. Multiple communication protocols are supported (COM/DCOM, RMI, XML/SOAP), providing flexible control systems integration (SECS/GEM, GPIB, Sensor Bus, and others). GWconX300+ incorporates GWEIB methods providing extended on-tool connectivity capabilities for implementing communications links on semiconductor wafer fabrication equipment, using the new SEMI EDA standards, as well as current 300mm standards. It provides run-time software libraries designed for incorporation with the embedded control software on any type of 300 mm equipment.

Asyst will be discussing its new equipment connectivity products at SEMICON West, July 14-16, booth #1338, South Hall at San Francisco’s Moscone Center.

About Asyst:

Asyst Technologies, Inc. is a leading provider of integrated automation solutions that enable semiconductor manufacturers to increase manufacturing productivity and protect investments in silicon wafers during the manufacture of integrated circuits, or ICs. The company offers a broad range of 200mm and 300mm solutions that enable the safe transfer of wafers and information between process equipment and the fab line throughout the IC fabrication process, while reducing IC damage caused by human, environmental, mechanical and chemical factors. Encompassing isolation systems, work-in-process materials management, substrate-handling robotics, automated transport and loading systems, and connectivity automation software, Asyst’s modular, interoperable solutions allow chipmakers and original equipment manufacturers, or OEMs, to select and employ the value-assured, hands-off manufacturing capabilities that best suit their needs. Asyst’s homepage is http://www.asyst.com

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