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Press Release

Asyst Receives Major Order from Leading U.S. Equipment Manufacturer


Multimillion-Dollar Order Comprises Portal and Robotics Technologies,
Represents Key Installation in Japan

Fremont, CA, March 15, 2001 - Asyst Technologies, Inc. (Nasdaq NM: ASYT), the world's largest semiconductor fab automation company, today announced it has received a multimillion-dollar, multiple-system order for its PlusT Portal tool front end from one of the world's leading U.S.-based providers of semiconductor manufacturing equipment. The order further bolsters Asyst's already strong presence in Japan-Asyst believes it is currently the leading U.S.-based automation solutions supplier to the Japanese semiconductor market.

The systems that constitute this order reflect a customer-specific design, incorporating an Asyst-Japan-developed and -built UTM-3500 robot with Asyst's Plus Portal front end-a fully automated and integrated front-end solution specifically designed to provide isolation and automation solutions for original equipment manufacturers' (OEMs') wafer processing and metrology tools. Asyst's acquisition of Japan-based MECS Corp. has proven invaluable in providing localized service and support to customers in Japan. By integrating with MECS, Asyst believes that it is not only better positioned to provide comprehensive local engineering design, manufacturing, integration and support services in the Pacific Rim, but better able, as well, to capitalize on the opportunities to upgrade existing 150mm and 200mm facilities with newer automation technologies.

Dennis Riccio, senior vice president of global customer operations for Asyst, said these orders substantiate the successful integration of the MECS family of advanced robotic systems into Asyst's automation offerings. "This integrated Plus Portal/MECS robot design reflects our ability to bring together complementary technologies to create high-value-add products that meet OEMs' specific needs," said Riccio. "Further, the installation of these systems in Japan helps expand Asyst's global presence and allows us to leverage the local infrastructure we now have in place, which is so important to supporting our installed base in this region."

Asyst reports that a key factor in the customer's decision to select the Asyst equipment was the substrate-handling robotic system designed into the tool. The MECS UTM-3500 robot features a six-axis, dual-arm design with a fast "swap out" speed-i.e., the time it takes for one wafer to be switched for another. Another unique feature of the robotic system is the absence of a linear track setup. Typically, a factory interface with multiple load ports requires "track robots." However, the UTM-3500 configuration enables the robot's access of up to four load ports without the need for a linear track, which simplifies integration with the process tool. Because the UTM-3500 configuration contains one less axis than standard robotic substrate-handling systems, mechanical reliability is increased. These benefits result in a higher throughput rate, enabling the equipment to process more wafers per hour.

Except for statements of historical fact, the statements in this press release are forward-looking. Such statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include, but are not limited to, general economic conditions, semiconductor industry cycles, risks associated with the acceptance of new products and product capabilities and other factors more fully detailed in the Company's recent 10Q quarterly report on file with the Securities and Exchange Commission

About Asyst
Asyst Technologies, Inc. is the leading provider of isolation and automation technologies that enable semiconductor makers to protect their valued assets throughout the manufacturing process while increasing manufacturing productivity. Through this "Value-Assured Fab" strategy, Asyst offers a broad range of 200mm and 300mm solutions that enable the safe transfer of wafers and information between the process equipment and the fab line throughout the IC fabrication process, preventing human, environmental, mechanical and chemical harm. Encompassing robotics, portals, wafer and reticle carriers, connectivity and interface products, and transport and loading products, Asyst's modular, interoperable solutions allow chipmakers and original equipment manufacturers (OEMs) to select and employ the value-assured, hands-off manufacturing capabilities that best suit their needs.

 


Copyright © 2005 Asyst Technologies, Inc.  All rights reserved.