Fremont, CA, February 6, 2001 -Asyst Technologies, Inc. (Nasdaq NM: ASYT), the world's largest semiconductor fab automation company, today announced it has received initial multiple orders, valued at approximately $5 million, for its 300mm front-opening unified pods (FOUPs) from leading semiconductor and foundry firms in Europe and Taiwan. These orders broaden Asyst's established lead in the rapidly growing market for 300mm FOUPs, which isolate costly 300mm wafers throughout the front-end semiconductor manufacturing process, protecting them from damage due to mishandling, contamination or electrostatic discharge. Shipments began this month, and will continue in stages throughout the first half of 2001.

The orders, secured over the past month, all reflect multi-year contracts for high-volume production quantities of the Asyst FOUPs, to be used on both pilot and production 300mm fab lines. In each case, the order was secured following an intensive competitive evaluation. At one site, the customer chose Asyst 300mm FOUPs over the incumbent for its transition from pilot into production use.

Key to the selection of the Asyst FOUPs was their compatibility with other Asyst 300mm product offerings, including the advanced SMART-Tag^TM ST-8400 infrared tracking and identification system, as well as some enhancements implemented by Asyst that will be standard features of the company's next-generation FOUP due in Q2 2001. These include: enhanced wafer-positioning accuracy to improve 300mm wafer handling; a drainable door to improve cleanability and drying times in advanced FOUP cleaning systems and prevent improper placement of the door into the FOUP; full compatibility with 300mm standards set forth by Semiconductor Equipment and Materials International (SEMI); a streamlined design aimed at optimizing high-volume manufacturing efficiencies; and a greater selection of product colors to facilitate identification of wafers at various process steps and help avoid cross-contamination issues associated with the introduction of copper and other metals into the chipmaking process.

According to Dennis Riccio, senior vice president of global customer operations for Asyst, these orders offer further evidence of Asyst's ability to deliver leading-edge products that anticipate customer needs. "Each of these customers, a market leader in its own right, has selected our FOUPs because we were able to clearly demonstrate the advantages of our products over the available competitive offerings," said Riccio. "Our close relationships with these customers enabled us not only to develop new capabilities based on their existing needs, but to anticipate and address their emerging needs, as well. We look forward to ongoing relationships with these and other customers as we continue to broaden our leadership in this market."

About Asyst
Asyst Technologies, Inc. is the leading provider of isolation and automation technologies that enable semiconductor makers to protect their valued assets throughout the manufacturing process while increasing manufacturing productivity. Through this "Value-Assured Fab" strategy, Asyst offers a broad range of 200mm and 300mm solutions that enable the safe transfer of wafers and information between the process equipment and the fab line throughout the IC fabrication process, preventing human, environmental, mechanical and chemical harm. Encompassing robotics, portals, wafer and reticle carriers, connectivity and interface products, and transport and loading products, Asyst's modular, interoperable solutions allow chipmakers and original equipment manufacturers (OEMs) to select and employ the value-assured, hands-off manufacturing capabilities that best suit their needs.