Fremont, CA, May 9, 2000 - Asyst Technologies, Inc. (Nasdaq NM: ASYT) today introduced the industry's first 200 mm Reticle SMIF-Pod™ (RSP). The 200 mm RSP is designed for automated handling, transport and storage of 6- and 9-inch reticles both within the mask shop and between the mask shop and the semiconductor fab.

Standard Mechanical InterFace (SMIF) technology is widely used for reticle and wafer management in semiconductor fabs due to its ability to isolate reticles and wafers from harmful contaminants and protect them from mishandling throughout the manufacturing process. Until now, however, mask shops have mainly been using shipper boxes—which have no automation capability—to store and transport 6- and 9-inch reticles. 150 mm reticle pods have been available on the market to transport and store 6-inch reticles, but cannot be modified to support 9-inch reticles due to physical size limitations. 200 mm wafer SMIF-Pods have been used in some cases to handle 9-inch reticle cassettes, but are too cumbersome to support single 9-inch reticles.

"As design rules shrink, contamination control is becoming ever more critical throughout all stages in the semiconductor manufacturing process. This is just as true for reticles as it is for patterned wafers," stated Dennis Riccio, Asyst Technologies' senior vice president of global customer operations. "If undetected during the photolithography process, a damaged reticle can greatly impact device yield. This impact will be even greater when the industry transitions to 300 mm wafers, which contain twice as many chips as 200 mm wafers. Using SMIF technology, such as our new 200 mm RSP, for reticle management can help minimize yield loss due to reticle contamination or mishandling."

The 200 mm RSP is a sealed container that maintains reticles in a better-than-Class 1 cleanroom environment and isolates the reticles from harmful contaminants. It is compatible with Asyst's 200 mm SMIF I/O LoadPorts-enabling automated loading onto lithography tools without requiring manual handling. This minimizes the danger of reticle damage from particle contamination or electrostatic discharge (ESD). The 200 mm RSP also incorporates Asyst's 200 mm Gen 4 Pod door latching mechanism and seal integrity, which evenly distributes force around the perimeter of the pod door, thus ensuring a secure seal between the door and top. In addition, the 200 mm RSP provides "edge to the edge" chamber reticle contact, which minimizes reticle movement inside the pod during transportation and shipment and prevents direct contact to the reticle surface. Other features of the 200 mm RSP include the incorporation of improved static dissipative materials and a low profile design that enables the pods to be stacked on top of one another, thus reducing footprint on the fab floor. The 200 mm RSP is also compliant with SEMI industry standards.

"The 200 mm RSP complements our existing line of reticle automation products, including reticle-handling robots, reticle sorters, automated ID systems and complete tool front ends," added Riccio. "Utilizing these technologies, mask shops can realize the same SMIF technology benefits that have served chipmakers so well in increasing their wafer and device yields."

200 mm RSPs are currently being shipped and beta-tested at customer sites. Production deliveries are expected to begin later this month.

Except for statements of historical fact, the statements in this press release are forward-looking. Such statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include, but are not limited to, general economic conditions, semiconductor industry cycles, risks associated with the acceptance of new products and product capabilities and other factors more fully detailed in the Company's recent 10-Q quarterly report on file with the SEC.

About Asyst:

Asyst Technologies, Inc. is the leading provider of SMIF-based minienvironment and manufacturing automation systems that enable semiconductor manufacturers to protect customers' valued assets throughout the manufacturing process while increasing manufacturing productivity. Asyst offers a broad range of 200 mm and 300 mm products that enable the Company to provide semiconductor manufacturers and OEMs automated manufacturing solutions for the transfer of wafers and information between the process equipment and the fab line.