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Press Release

Asyst
Technologies Receives Multimillion-Dollar Order
for Reticle
SMIF Solutions

Order coincides with I300I's
selection of SMIF architecture for reticle handling in 300
mm IC fabs
Fremont, CA, May 13, 1999-Asyst
Technologies, Inc. (Nasdaq:ASYT), the leading supplier of Standard
Mechanical InterFace (SMIF) isolation and manufacturing automation
solutions to the semiconductor industry, today announced it has
received a multimillion-dollar order from a large U.S. reticle
manufacturer for its Asyst reticle SMIF systems, which will be
used in the manufacture of advanced reticles. The order marks
the first time that SMIF technology will be deployed in a reticle
manufacturing facility and also coincides with the International
300 mm Initiative (I300I's) selection of reticle SMIF technology
as the standard for reticle carriers and automation in 300 mm
integrated circuit (IC) fabs, providing a common reticle tool
interface. Tools for this customer are scheduled for installation
beginning in June 1999.
Commenting on the significance of
the order, Asyst's Senior Vice President of Global Customer Operations
Dennis Riccio noted, "For more than 12 years, Asyst-SMIFÔ technology
has been widely accepted for both reticle and wafer management
in semiconductor facilities, including approximately 50,000 Asyst
reticle SMIF pods in use worldwide. However, SMIF has not been
widely deployed in reticle manufacturing facilities to date.
As reticle manufacturing protocols become more complex and stringent,
they drive the requirements for advanced contamination control
and automated material handling that SMIF provides. We are pleased
to be partnering with this customer in pioneering automated reticle
manufacturing, helping them move directly to 'hands-off' reticle
manufacturing." Riccio continued, "This represents a great deal
of untapped market potential for SMIF technology and for Asyst."
The customer's selection of Asyst
as its reticle SMIF tool supplier was based on the following
criteria: (1) the need for contamination control capable of meeting
current and future requirements; (2) the need for a pod architecture
that accommodates both 6-inch and 230 mm reticles - the next
generation reticle size; (3) the ability to provide "edge of
the edge" contact only reticle handling; and (4) the use of existing
industry standards and equipment. The customer's prior experience
with Asyst-SMIF for semiconductor manufacturing was also a factor
in the decision.
Reticles-patterned quartz substrates
used in conjunction with steppers to print images on a silicon
wafer are essential in creating the master device images on which
ICs are based - represent substantial investments for both the
chipmakers and reticle manufactures. Reticles can cost up to
$40,000, and on average, more than 20 different reticles are
used to produce a semiconductor device. Defects on the reticle
are converted as flawed images or patterns on the semiconductor
wafer after each exposure in the photolithography process, semiconductor
yields can be greatly affected. The area of reticles subject
to defects as a result of particles or contaminants, misprocessing,
and electrostatic discharge (ESD) is much larger than that of
a semiconductor die. In addition, defects considered critical
to reticles are now the size that was considered critical to
semiconductors only a few years ago.
SMIF provides a means of protecting
reticles from these defects by isolating the reticles from potential
contaminants and providing 'hands-off' reticle management during
reticle manufacture or wafer processing. During reticle manufacture,
SMIF enables the use of auto-ID, helping to eliminate misprocessing.
In addition, SMIF can be used to significantly extend the life
of existing mask manufacturing facilities.
The order includes Asyst's reticle
pods, which provide contamination control during reticle transportation
and storage, as well as Asyst's reticle SMIF interface systems
and Asyst's reticle SMIF minienvironments for the reticle manufacturing
tools and new reticle sorters. Asyst's reticle SMIF pods are
the first designed to handle both 6-inch and 230 mm reticles.
In addition, Asyst's reticle pods provide the capability to address
the transport and protection requirements of the masks used in
the Scattering with Angular Limitation Projection Electron-beam
Lithography (SCALPEL®) process invented by Bell Labs. SCALPEL
technology was recently recommended by International SEMATECH
as one of two possible successors to optical lithography. Asyst's
reticle SMIF tools will be used in the production of leading-edge
photomasks for the customer's captive and merchant customers.
Reticle SMIF architecture has been
selected by I300I as the design standard for storing and transporting
reticles in future 300 mm IC fabs. Asyst's reticle pod, based
on its 200 mm SMIF-PodÔ, allows any reticle size up to 230 mm
to be accommodated. A new Semiconductor Equipment and Materials
International (SEMI) standard for this reticle pod is currently
being balloted for approval. This technology uses existing 200
mm SEMI SMIF and loadport standards. Consequently, it allows
reticle equipment suppliers to leverage SMIF interfaces and automation
solutions proven in more than 65 semiconductor fabs worldwide.
According to Anthony Bonora, Asyst's
senior vice president and chief technology officer, "This SMIF
project has been favorably received by reticle equipment suppliers,
who have long called for an established standard for reticle
carriers and reticle manufacturing automation. Reticle equipment
suppliers can concentrate on their differentiating process and
metrology technology, not user-specific automation requirements.
Equally important, reticle manufacturers can now benefit from
the proven material handling, tool interface and automation capabilities
SMIF has provided IC makers for many years." Asyst's reticle
SMIF solutions are now available for OEM integration.
Except for statements of historical
fact, the statements in this press release are forward-looking.
Such statements are subject to a number of risks and uncertainties
that could cause actual results to differ materially from the
statements made. These factors include, but are not limited to,
general economic conditions, semiconductor industry cycles, risks
associated with the acceptance of new products and product capabilities,
and other factors more fully detailed in the Company's most recent
Forms 10-K and 10-Q, and annual report to shareholders.
About Asyst:
The pioneer of the Standard Mechanical InterFace (SMIF), Asyst
Technologies, Inc. is the leading provider of automated material
handling systems and software critical to seamless factory
automation in the most advanced fabs worldwide. Asyst's comprehensive
solutions, which include industry-leading loadport, auto ID,
environmental control, robotic, and automation software products
for 200 mm and 300 mm applications, result in greater fab profitability
and productivity.
Scattering with Angular Limitation
Projection Electron-beam Lithography and SCALPEL are registered
trademarks of Bell Labs.
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